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PROCESS |
DESCRIPTION |
CHEMICAL COMPOSITION |
PROCESS TEMP |
RECOMMENDED PRODUCT |
|
R.C.A. CLEAN |
PRE-DIFFUSION CLEAN |
HYDROGEN PEROXIDE AMMONIUM FLUORIDE/ HYDROGEN PEROXIDE HYDROCHLORIC ACID DI WATER |
75-85OC |
SQ |
|
SILICON ETCH |
ETCH |
ACETIC ACID NITRIC ACID HYDROFLUORIC ACID |
20OC |
ST PVDF |
|
SIRTL ETCH |
ETCH |
CHROMIUM TRIOXIDE HYDROFLUORIC ACID DI WATER |
20OC |
ST PVDF |
|
SLOPE ETCH |
ETCH |
PHOSPHORIC ACID ACETIC ACID NITRIC ACID |
55OC |
SQ |
|
STANDARD RESIST STRIP |
SiO2 STRIP |
SULPHURIC ACID HYDROGEN PEROXIDE |
110-140OC |
SQ |
|
DIFFUSION CLEAN |
SC1 |
AMMONIUM HYDROXIDE HYDROGEN PEROXIDE |
80-1200C |
SQ |
|
DIFFUSION CLEAN |
SC2 |
HYDROCHLORIC ACID HYDROGEN PEROXIDE |
80-1200C |
SQ |
FabTronics Ltd |
23 Braeview Drive Paisley PA2 8PW
|
